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Manufacturing Services :: Flip-Chip RFID Inlets
 

  • Capacity of 800K per week

    •  Additional capacity will be added in Q2 2005

    •  Manufacturing in the U.S. with expansion capability planned for China and Thailand

  •  Web width: 460 mm max.

  •  Reel diameter: 600 mm max.

  •  Wafer size: up to 8”

  •  Die size: 0.5 x 0.5 mm min.

  •  Web slitting capability

  •  Interleafing capability

  •  Die placement accuracy: +/- 50 microns

  •  ACP/NCP Adhesives

  •  Substrate materials

    •  Copper on Polyimide, PEN, or PET

    •  Printed ink on paper or film


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© 2004 HANA RFID   ALL RIGHTS RESERVED